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oorfield Nanotechnology are UK Laboratory Equipment specialists in PVD (Physical Vapour Deposition), CVD (Chemical Vapour Deposition) and Etch Systems. Their systems are used for academic and industrial research, including semiconductors, photovoltaics, graphene and 2D materials.

Moorfield’s world-class scientific laboratory equipment is built to match your research needs. We can also service and repair existing tools, and provide advice relating to a custom project.

MiniLab

MiniLab 026

MiniLab 026 tools include a turbomolecular pump positioned on an ISO100 port at the rear of the vacuum chamber. The base of the vacuum chamber sits, as a well, into the supporting frame. The chamber lid can be either a stainless-steel top-hat style lid (i.e., for a ‘clam-shell’ type chamber arrangement), or a bell-jar — similar to the Edwards E306. Systems can be equipped with a wide variety of deposition techniques.

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Minilab060

Tools can be equipped with a wide variety of deposition techniques, including thermal and low-temperature evaporation sources (for metals and organics), magnetron sputtering cathodes (for metals and inorganics), and electron-beam sources (for most material classes except organics). Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.

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Minilab080

The tools are ideally suited to evaporation techniques where long working distances are required for best uniformity, and where evaporant incident angles close to 90° allow for optimal results for lift-off applications. However, as well as thermal, LTE and e-beam evaporation, the tools can also be fitted for magnetron sputtering (commonly as a multi-technique system).

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Minilab125

MiniLab 125 systems are floor-standing vacuum evaporators for metal, dielectric and/or organics thin-film deposition. All systems contain a box-type stainless-steel chamber with a front door for loading/unloading. Large chamber volumes enable large sources for pilot-scale coating or multiple techniques for a flexible R&D tool. Systems are available fitted with all major deposition techniques and stages customised to specific substrates.

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nanoCVD

nanoCVD-8G

DEPOSICIÓN QUÍMICA DE VAPOR

Developed in collaboration with academic groups, the nanoCVD-8G is a graphene CVD system that provides precise control over conditions such as pressure, temperature and gas chemistry – critical for successful production of graphene.

The units implement the cold-wall variant of the CVD method, enabling reduced contamination, low running costs and better control as compared to tube-furnace counterparts.

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nanoPVD

nanoPVD-S10A

The nanoPVD-S10A is a magnetron sputtering system compact enough to be located benchtop, but that can be fitted with DC and/or RF power supplies for deposition of metals or insulating materials such as oxides or nitrides.

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nanoPVD-ST15A

The latest model in Moorfield’s nanoPVD range, model ST15A has been purpose-designed to accommodate both vacuum evaporation and magnetron sputtering sources within the a single process chamber. Available source types are low-temperature evaporation (LTE), standard resistive evaporation, and magnetron sputtering (2″ targets) for deposition of organics, dielectrics, and metals.

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nanoPVD-T15A

Model T15A can be equipped with low-temperature evaporation (LTE) and standard resistive evaporation sources for deposition of organics and metals, respectively. LTE sources are low thermal-mass for better control when evaporating volatile organic materials, while metals sources are our box-shielded TE1 models for efficient deposition and reduced cross-contamination.

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nanoETCH

nanoETCH

GRASADO DE PLASMA

The nanoETCH is a benchtop tool equipped with a high-uniformity plasma etching stage and an RF power supply for plasma generation. The tool was originally developed in collaboration with the graphene group at the National Graphene Institute at the University of Manchester, UK.

This development was driven by the requirement within the research community for an etching tool that allowed for precision etching of sensitive 2D materials — not available in conventional RIE tools.

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