our reliable partner for exhaust gas abatement. As an internationally operating company with a global network of service centres, CS CLEAN SOLUTIONS AG have been serving customers in the semiconductor and related high tech industries for over 25 years.
Based on proprietary dry bed absorption technology, their products have earned an unparalleled track record for safety, process reliability and environmentally-sustainable manufacturing.
Whether your application relates to semiconductors, photovoltaics, pharmaceuticals or chemicals, if it requires removal of downstream reactive gases please contact us and discover the advantages of CS CLEAN SOLUTIONS unique technology.
CLEANSORB® STAND ALONE
For small-scale research work, stand-alone absorber columns can be used to remove remaining gas concentrations downstream of the experimental chamber. Several safety components are available as accessories, including an air-extractable housing cabinet as well as options for pressure monitoring and downstream gas detection.
A small absorber column housed in a compact, air-extracted cabinet. Is permanently on ready and does not have to be heated up or otherwise activated each time a new experiment is to be run.
Is the standard CLEANSORB model for waste gas removal on factory-scale applications. Available in three column sizes, the system is readily adaptable to the requirements of both pilot line and full-scale manufacturing.
has been especially engineered to handle the gas flows and related operating conditions of safety-critical process applications, notably those of Metal Organic Chemical Vapor Deposition (MOCVD).
Available for a wide range of special purpose gases
At the heart of the CLEAN-PROTECT system is the dry chemisorbent material, CLEANSORB®. Escaping gases undergo an irreversible chemical reaction (oxidation or neutralization) within the CLEAN-PROTECT system, where they are safely converted into solid by-products. The system is installed inline with downstream air extract ducting and does not require power or other facilities to operate, meaning that it is permanently on stand-by.
The CLEAN-PROTECT system is manufactured from high-quality 316L stainless steel. In the absence of a gas release incident the change-out frequency of the absorber bed is five years.
CLEANVENT – Mini cartridge for gas cabinet vent lines
For over 20 years the CLEANVENT cartridge has proven itself a safe solution for the removal of hazardous purge gases.
Installed within the gas cabinet on the suction side of the venturi vacuum generator, or in a valve manifold box, the CLEANVENT cartridge allows residual gases to be scrubbed “at-source“.
Designed to absorb toxic or dangerous gases in case of emergency due to gas leakage
Before a new gas cylinder is put on-line within a gas supply cabinet, process gas remaining from the previous cylinder must first be removed – both for reasons of safety and to ensure integrity of the fresh gas supply. The dead volume of residual gas is likely to be highly concentrated, toxic, pyrophoric, or corrosive, thus posing a considerable safety hazard.
Purge gases are evacuated through the absorber bed of the cartridge and are purified from hazardous gas concentrations by irreversible chemical conversion to solids. Refillable CLEANVENT cartridge types are available for a broad range of specialty gases and are supported by CS CLEAN SYSTEMS worldwide network of service partners.
PIRANHA – Abatement of global warming PFC gases
Most semiconductor manufacturers have already begun to implement measures to combat PFC emissions, with PFC abatement a key part of an overall reduction strategy.
Purification of PFC gases responsible for global warming
The semiconductor industry has committed itself to further reduce its emissions of perfluorinated compounds (PFCs), which give rise to the “greenhouse effect”. Most semiconductor manufacturers have already begun to implement measures to combat PFC emissions, with PFC abatement a key part of an overall reduction strategy.
PFC gases such as CF4, CHF3, SF6 and NF3 are emitted from semiconductor Plasma Etch and Strip processes as well as CVD Chamber Cleans.
The PCS PIRANHA foreline plasma conversion systems are designed to convert the stable PFCs to reactive by-products. The PCS PIRANHA is installed in the vacuum foreline of the etch chamber for maximum efficiency. Small flows of a reaction partner such as oxygen or water are added to prevent re-combination of the dissociated F and C atoms. The reactive by-products are best removed using a CLEANSORB®dry bed chemisorber.