Avactec is now an agent for MEMS systems from memsstar
The ORBIS™ range of tools are used for silicon or oxide etch using the technique of vapour phase dry release etching.
MEMS Technology Development
memsstar is a leader in MEMS process technology development, working independently and in conjunction with leading research organizations such as the Fraunhofer Institute, and commercial partners including Millipore Sigma.
One example of the company’s technology development is its use of amorphous silicon (a-Si) as a sacrificial layer in the construction of MEMS. Developed with the Fraunhofer Institute, the module enables the a-Si film to be deposited in a modified industry standard PECVD reactor as a sacrificial etch layer for subsequent isotropic release etching using the memsstar XERIC™ system. The module has fully characterized etch selectivity to many other materials, fast etch rates and excellent uniformity and repeatability. This integrated process sequence can be used within standard CMOS facilities or on top of CMOS wafers to enable many possible new applications.